Seiji Naganuma's Location
Honolulu, HI, US
Seiji Naganuma's Work
Seiji Naganuma's Education
Seiji Naganuma's Skills
Seiji Naganuma's Summary
Seiji Naganuma, based in Honolulu, HI, US, is currently a Head of Engineering at Wisp, bringing experience from previous roles at Wisp and Curology. Seiji Naganuma holds a 2006 - 2010 B.S. in Material Science Engineering @ UCLA. With a robust skill set that includes ETL, Data Warehousing, Git, Business Intelligence Tools, jQuery and more, Seiji Naganuma contributes valuable insights to the industry. Seiji Naganuma has 3 emails on RocketReach.