Sebastian Wicklein Email
Director, Business Development and R and D Coordination @ Fraunhofer USA Inc.
Sebastian Wicklein's Location
Plymouth, MI, US
Sebastian Wicklein's Work
- Director, Business Development and R and D Coordination @ Fraunhofer USA Inc.
- Lead, Corporate R and D Coordination @ Fraunhofer USA Inc.
- NVM Device Integration and Yield Engineer @ Intel Corporation
- NVM Device Integration and Yield Engineer @ Intel Corporation
- Principal Engineer, R and D Engineering @ SanDisk®
- Staff Engineer @ SanDisk®
- Senior Device Engineer @ SanDisk®
- Ph.D. Candidate @ Forschungszentrum Jülich
- Project Engineer @ Ostbayerische Technische Hochschule Regensburg
- Project Engineer @ Fraunhofer-Gesellschaft
Sebastian Wicklein's Education
- Christian-Albrechts-Universität zu Kiel
Ph.D. (Materials Sciences)
- Fachhochschule Aalen
Dipl.-Ing. (Fh) (Surface Engineering and Materials Sciences)
2002 - 2006
Sebastian Wicklein's Skills
- Thin Film Technology
- Reram
- Semiconductor Device Physics
- Semiconductor Device Engineering and Testing
- COMSOL
- Density Functional Theory
- Python
- HSPICE
- Complex Oxides
- Memory Device Engineering and Testing
Sebastian Wicklein's Summary
Sebastian Wicklein, based in Plymouth, MI, US, is currently a Director, Business Development and R and D Coordination at Fraunhofer USA Inc., bringing experience from previous roles at Fraunhofer USA Inc., Intel Corporation and SanDisk®. Sebastian Wicklein holds a Ph.D. in Materials Sciences @ Christian-Albrechts-Universität zu Kiel. With a robust skill set that includes Thin Film Technology, Reram, Semiconductor Device Physics, Semiconductor Device Engineering and Testing, COMSOL and more, Sebastian Wicklein contributes valuable insights to the industry. Sebastian Wicklein has 2 emails on RocketReach.
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