Sam Dalrymple Email & Phone Number
Sr. Engineering Manager: Package and Board Design Tools @ Intel Corporation
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Sam Dalrymple Location
- Hillsboro, OR, US
Sam Dalrymple Work
- 2000 -now Sr. Engineering Manager: Package and Board Design Tools @
- 2000 -now Board and Web Tools Manager @
- 2000 -2000 Board Initiatives, Tools and Solutions TD Manager @
- 2000 -2000 Sr. Engineering Manager, Package and Board Design Tools @
- 2000 -2000 Sr. Engineering Manager: Package and Board Design Tools @
Sam Dalrymple Skills
- Microsoft Office
- Verilog
- Manufacturing
- SoC
- C
- Program Management
- Management
- Project Management
- Cross-functional Team Leadership
- Semiconductors
- C++
- IC
- ASIC
- Cross Functional Team Leadership
Sam Dalrymple Summary
- Sam Dalrymple, based in Hillsboro, OR, US, is currently a Sr. Engineering Manager: Package and Board Design Tools at Intel Corporation. Sam Dalrymple brings experience from previous roles at Intel Corporation. With a robust skill set that includes Microsoft Office, Verilog, Manufacturing, SoC, C and more. Sam Dalrymple has 3 emails and 2 mobile phone numbers on RocketReach.
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