Ryan Thorpe Email & Phone Number
Vice President, Package Engineering @ iDEAL Semiconductor Devices Inc
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Ryan Thorpe Location
- Dallas, TX, US
Ryan Thorpe Work
- 2022 -now Vice President, Package Engineering @
- 2017 -2022 Director, Semiconductor Package Technology Development @
- 2016 -2017 Manager, New Package Technology Ramp | All Technologies @
- 2015 -2016 Manager, Packaging Technology Development | Wirebond, High Voltage, Power Research and Development Lab @
- 2014 -2015 Manager, Research and Development Lab @
- 2012 -2014 Manager, Packaging Technology Development | Flip Chip, Power Packaging @
- 2011 -2012 Manager, Assembly Site Packaging Technology and New Product Development @
- 2004 -2011 Various Individual and Manager Roles in Packaging Technology Development @
- 1999 -2004 Packaging Engineer @
Ryan Thorpe Education
- Georgia Institute of Technology
Masters (Mechanical Engineering)
- UC San Diego
Bachelors (Mechanical Engineering)
Ryan Thorpe Summary
- Ryan Thorpe, based in Dallas, TX, US, is currently a Vice President, Package Engineering at iDEAL Semiconductor. Ryan Thorpe brings experience from previous roles at Texas Instruments. Ryan Thorpe holds a Masters in Mechanical Engineering @ Georgia Institute of Technology. Ryan Thorpe has 2 emails and 1 mobile phone numbers on RocketReach.
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