Ryan Thorpe Email & Phone Number

Vice President, Package Engineering @ iDEAL Semiconductor Devices Inc

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Ryan Thorpe Location

Dallas, TX, US

Ryan Thorpe Work

2022 - now Vice President, Package Engineering @ iDEAL Semiconductor Devices Inc
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2017 - 2022 Director, Semiconductor Package Technology Development @ Texas Instruments
2016 - 2017 Manager, New Package Technology Ramp | All Technologies @ Texas Instruments

2015 - 2016 Manager, Packaging Technology Development | Wirebond, High Voltage, Power Research and Development Lab @ Texas Instruments
2014 - 2015 Manager, Research and Development Lab @ Texas Instruments
2012 - 2014 Manager, Packaging Technology Development | Flip Chip, Power Packaging @ Texas Instruments
2011 - 2012 Manager, Assembly Site Packaging Technology and New Product Development @ Texas Instruments
2004 - 2011 Various Individual and Manager Roles in Packaging Technology Development @ Texas Instruments
1999 - 2004 Packaging Engineer @ Kyocera America Inc

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Ryan Thorpe Education

Georgia Institute of Technology
Masters (Mechanical Engineering)
UC San Diego
Bachelors (Mechanical Engineering)

Ryan Thorpe Summary

Ryan Thorpe, based in Dallas, TX, US, is currently a Vice President, Package Engineering at iDEAL Semiconductor. Ryan Thorpe brings experience from previous roles at Texas Instruments. Ryan Thorpe holds a Masters in Mechanical Engineering @ Georgia Institute of Technology. Ryan Thorpe has 2 emails and 1 mobile phone numbers on RocketReach.

Ryan Thorpe Emails

Found 2 emails

Ryan Thorpe Phone Numbers

Found 2 phone numbers

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Mark Granahan

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Philadelphia, PA, US
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Mark Cummins

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Rodney Hsing

VP Distribution and Sales Operations at iDEAL Semiconductor Devices Inc

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Bogdan Proca

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