Ryan Thorpe Email & Phone Number
Vice President, Package Engineering @ iDEAL Semiconductor Devices Inc
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Ryan Thorpe Location
- Dallas, TX, US
Ryan Thorpe Work
- Vice President, Package Engineering @ (August 2022 - Present)
- Director, Semiconductor Package Technology Development @ (December 2017 - August 2022)
- Manager, New Package Technology Ramp | All Technologies @ (December 2016 - December 2017)
- Manager, Packaging Technology Development | Wirebond, High Voltage, Power Research and Development Lab @ (August 2015 - December 2016)
- Manager, Research and Development Lab @ (September 2014 - August 2015)
- Manager, Packaging Technology Development | Flip Chip, Power Packaging @ (June 2012 - September 2014)
- Manager, Assembly Site Packaging Technology and New Product Development @ (January 2011 - June 2012)
- Various Individual and Manager Roles in Packaging Technology Development @ (August 2004 - January 2011)
- Packaging Engineer @ (August 1999 - August 2004)
Ryan Thorpe Education
- Georgia Institute of Technology
Masters (Mechanical Engineering)
- UC San Diego
Bachelors (Mechanical Engineering)
Ryan Thorpe Summary
- Ryan Thorpe, based in Dallas, TX, US, is currently a Vice President, Package Engineering at iDEAL Semiconductor. Ryan Thorpe brings experience from previous roles at Texas Instruments. Ryan Thorpe holds a Masters in Mechanical Engineering @ Georgia Institute of Technology. Ryan Thorpe has 2 emails and 1 mobile phone numbers on RocketReach.
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