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Ryan Shook Location
Chaska, MN, US
Ryan Shook Work
2019 -now Technical Sales Manager @
2017 -2019 Senior Packaging Engineer @
2017 -2019 Senior Packaging Engineer @
2014 -2017 Key Account Manager @
2010 -2014 Senior Packaging Engineer @
2008 -2010 Packaging Engineer II @
2006 -2008 Packaging Engineer I @
2006 -2006 Packaging Engineer @
Ryan Shook Education
Hamline University
Masters (Business Management Administration)
2009-2010
University of Wisconsin-Stout
BS Packaging (Packaging Engineering)
2001-2006
Hamline University
University of Wisconsin-Stout
Ryan Shook Skills
Leadership
Six Sigma
Injection Molding
Packaging
Lean Manufacturing
Cross Functional Team
Sales
GMP
Plastics
Business Development
Engineers
CAD
Process Improvement
Validation
Medical Devices
Support
Quality System
Cross Functional Team Leadership
Manufacturing
Design of Experiments
Business Strategy
Solidworks
Product Launch
Product Development
Packaging Engineering
Continuous Improvement
R&D
FDA
Ryan Shook Summary
Ryan Shook, based in Chaska, MN, US, is currently a Technical Sales Manager at Placon Corporation. Ryan Shook brings experience from previous roles at Abbott, Amcor Flexibles Europe & Americas and Boston Scientific. Ryan Shook holds a 2009 - 2010 Masters in Business Management Administration @ Hamline University. With a robust skill set that includes Leadership, Six Sigma, Injection Molding, Packaging, Lean Manufacturing and more. Ryan Shook has 2 emails and 1 mobile phone numbers on RocketReach.
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