Ryan Sharma Location
San Diego, CA, US
Ryan Sharma Work
- 2015 - now IC Packaging Director @ Silanna Semiconductor
- 2007 - 2015 IC Package Principal Engineer and Manager @ Entropic Communications
- 2003 - 2007 IC Package Staff Engineer and Manager @ Qualcomm
- 1999 - 2002 IC Package Principal Engineer @ AppliedMicro
Ryan Sharma Education
- Louisiana State University
MS (Mechanical Engineering)
- Arizona State University
M.S. Industrial Engineering
Ryan Sharma Skills
- Project Management
- Software Development
- SQL
- Marketing
- Leadership
- Packaging
- Engineering
Ryan Sharma Summary
Ryan Sharma, based in San Diego, CA, US, is currently a IC Packaging Director at Silanna Semiconductor. Ryan Sharma brings experience from previous roles at Entropic, Qualcomm and AMCC. Ryan Sharma holds a MS in Mechanical Engineering @ Louisiana State University. With a robust skill set that includes Project Management, Software Development, SQL, Marketing, Leadership and more. Ryan Sharma has 2 emails on RocketReach.
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