Ryan Pate Email & Phone Number
Assembly and Packaging Technology Development Engineering Manager @ Intel Corporation
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Ryan Pate Location
- Chandler, AZ, US
Ryan Pate Work
- 2020 -now Assembly and Packaging Technology Development Engineering Manager @
- 2015 -2020 Defect Metrology Engineering Manager and Integration Engineering Manager @
- 2011 -2015 Defect Metrology and Yield Integration Engineer @
- 2008 -2011 Senior Editor @ American Journal Experts
- 2006 -2011 Research Assistant @
Ryan Pate Education
- Duke University
Ph.D. (Electrical Engineering/Material Science/Nanophotonics/semiconductors/conjugated polymers)
2006-2011 - University of Florida
M.S. (Materials Science)
2004-2006 - University of Florida
B.S. (Computer Electrical Engineering)
1999-2004
Ryan Pate Skills
- AFM
- Scanning Electron Microscopy
- Physics
- Photolithography
- LabVIEW
- Matlab
- Sputtering
- Powder X-ray Diffraction
- Mathematica
- TEM
- Semiconductor Industry
- Manufacturing
- Yield
- Quality Control
- Defect Identification
- Defect Elimination
- Analytical Techniques
- Quantitative Analytics
- Quantitative Research
- Leadership
- Engineering Management
- Lean Manufacturing
- Post Ramp Qualification
- Oxide Thin Films
- Powder X Ray Diffraction
- Quality Engineering
- Statistical Process Control Spc
- Business Development
- JMP
- Strategic Planning
- Thin Films
- ISO 9001
- Strategy
- Engineering
- Characterization
- Operations Management
- Program Management
- Cross Functional Team Leadership
- Design of Experiments
- Failure Mode And Effects Analysis Fmea
- Business Process Improvement
- Management
- Semiconductors
- Simulations
- Product Development
- Project Management
- Lean Six Sigma
- Ultra High Vacuum Uhv
- Cost Management
- Integration
- Materials Science
- Pulsed Laser Deposition
- Failure Mode and Effects Analysis
Ryan Pate Summary
- Ryan Pate, based in Chandler, AZ, US, is currently a Assembly and Packaging Technology Development Engineering Manager at Intel Corporation. Ryan Pate brings experience from previous roles at Intel Corporation, American Journal Experts and Duke University. Ryan Pate holds a 2006 - 2011 Ph.D. in Electrical Engineering/Material Science/Nanophotonics/semiconductors/conjugated polymers @ Duke University. With a robust skill set that includes AFM, Scanning Electron Microscopy, Physics, Photolithography, LabVIEW and more. Ryan Pate has 3 emails and 1 mobile phone numbers on RocketReach.
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