Ryan Pate Email
Assembly and Packaging Technology Development Engineering Manager @ Intel Corporation
Ryan Pate's Location
Chandler, AZ, US
Ryan Pate's Work
- Assembly and Packaging Technology Development Engineering Manager @ Intel Corporation
- Defect Metrology Engineering Manager and Integration Engineering Manager @ Intel Corporation
- Defect Metrology and Yield Integration Engineer @ Intel Corporation
- Senior Editor @ AJE
- Research Assistant @ Duke University
Ryan Pate's Education
- Duke University2006 - 2011
- 1999 - 2004
Ryan Pate's Skills
- AFM
- Scanning Electron Microscopy
- Physics
- Photolithography
- LabVIEW
- Matlab
- Sputtering
- Powder X-ray Diffraction
- Mathematica
- TEM
Ryan Pate's Summary
Ryan Pate, based in Chandler, AZ, US, is currently a Assembly and Packaging Technology Development Engineering Manager at Intel Corporation, bringing experience from previous roles at Intel Corporation, American Journal Experts and Duke University. Ryan Pate holds a 2006 - 2011 Duke University. With a robust skill set that includes AFM, Scanning Electron Microscopy, Physics, Photolithography, LabVIEW and more, Ryan Pate contributes valuable insights to the industry. Ryan Pate has 1 email on RocketReach.
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