Ryan Kruse Email & Phone Number
Senior Technical Staff Member (STSM), Future Chip Physical Architecture and Design Convergence @ IBM
Ryan Kruse's Location
Round Rock, TX, US
Ryan Kruse's Work
- Senior Technical Staff Member (STSM), Future Chip Physical Architecture and Design Convergence @ IBM
- Senior Engineer, Chip Physical Design and Integration @ IBM
- Advisory Engineer, Chip Physical Integration @ IBM
- Staff Engineer, Unit Physical Integration @ IBM
- Hardware Engineer, SPARC Microprocessors @ Sun Microsystems
- Development Engineer, i and p Series Servers @ IBM
Ryan Kruse's Education
- University of Washington
MS (Electrical Engineering)
2003 - 2005 - New Mexico Institute of Mining and Technology
BS (Electrical Engineering)
1999 - 2003
Ryan Kruse's Skills
- Cadence Virtuoso
- Signal Integrity
- Digital Electronics
- Floorplanning
- Debugging
- SPICE
- Perl
- Microprocessors
- Processors
- PCB design
Ryan Kruse's Summary
Ryan Kruse, based in Round Rock, TX, US, is currently a Senior Technical Staff Member (STSM), Future Chip Physical Architecture and Design Convergence at IBM, bringing experience from previous roles at IBM and Sun Microsystems. Ryan Kruse holds a 2003 - 2005 MS in Electrical Engineering @ University of Washington. With a robust skill set that includes Cadence Virtuoso, Signal Integrity, Digital Electronics, Floorplanning, Debugging and more, Ryan Kruse contributes valuable insights to the industry. Ryan Kruse has 2 emails and 2 mobile phone numbers on RocketReach.
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