Ryan Hooper Email & Phone Number
Director, MEMS Sensors Packaging @ STMicroelectronics
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Ryan Hooper Location
- Mesa, AZ, US
Ryan Hooper Work
- 2026 - now Director, MEMS Sensors Packaging @
- 2015 - 2026 Technical Director, Package Innovation, Sensors and Radio Power Packaging @
- 2003 - 2015 Package Development Engineer @
- 2002 - 2002 Engineering Intern @
- 2000 - 2000 Engineering Intern @
Ryan Hooper Education
- Arizona State University
BSE (Chemical Engineering)
- Arizona State University
Masters of Science in Engineering (Materials Engineering)
Ryan Hooper Skills
- Solidworks
- Semiconductor Packaging
- Development
- Packaging
- MEMS
- Semiconductors
- Semiconductor Industry
- Design of Experiments
- Accelerometer
- Materials Science
- Pressure Sensors
Ryan Hooper Summary
- Ryan Hooper, based in Mesa, AZ, US, is currently a Director, MEMS Sensors Packaging at STMicroelectronics. Ryan Hooper brings experience from previous roles at NXP Semiconductors, Freescale Semiconductor and Motorola. Ryan Hooper holds a BSE in Chemical Engineering @ Arizona State University. With a robust skill set that includes Solidworks, Semiconductor Packaging, Development, Packaging, MEMS and more. Ryan Hooper has 3 emails and 2 mobile phone numbers on RocketReach.
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