Technical Director, Package Innovation, Sensors and Radio Power Packaging @ (December 2015 - February 2026)
Package Development Engineer @ (May 2003 - December 2015)
Engineering Intern @ (May 2002 - August 2002)
Engineering Intern @ (May 2000 - August 2000)
Ryan Hooper Education
Arizona State University
BSE (Chemical Engineering)
Arizona State University
Master of Science in Engineering (Materials Engineering)
Ryan Hooper Skills
Accelerometer
Design of Experiments
MEMS
Materials Science
Pressure Sensors
Semiconductor Industry
Semiconductor Packaging
SolidWorks
Development
Packaging
Semiconductors
Ryan Hooper Summary
Ryan Hooper, based in Mesa, AZ, US, is currently a Director, MEMS Sensors Packaging at STMicroelectronics. Ryan Hooper brings experience from previous roles at NXP Semiconductors, Freescale Semiconductor and Motorola. Ryan Hooper holds a BSE in Chemical Engineering @ Arizona State University. With a robust skill set that includes Accelerometer, Design of Experiments, MEMS, Materials Science, Pressure Sensors and more. Ryan Hooper has 3 emails and 2 mobile phone numbers on RocketReach.
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