Ryan Casanova Location
Kalamazoo, MI, US
Ryan Casanova Work
- 2022 - now Technical Sales Engineer @ Hexagon Manufacturing Intelligence
- 2021 - 2022 Product Engineer @ Shiloh Industries
- 2008 - 2021 Product Engineer @ Benteler Automotive
- 2006 - 2008 Product Engineer @ Trelleborg Group
Ryan Casanova Education
- Western Michigan University
Bachelors (Mechanical Engineering)
2002 - 2005 - Macomb Community College
(ENGINEERING)
2000 - 2002
Ryan Casanova Skills
- TS16949
- 5s
- GD&T
- Geometric Dimensioning
- Kaizen
- PPAP
- Automotive
- APQP
- SPC
- FMEA
Ryan Casanova Summary
Ryan Casanova, based in Kalamazoo, MI, US, is currently a Technical Sales Engineer at Hexagon Manufacturing Intelligence. Ryan Casanova brings experience from previous roles at Shiloh Industries, Benteler Automotive and Trelleborg. Ryan Casanova holds a 2002 - 2005 Bachelors in Mechanical Engineering @ Western Michigan University. With a robust skill set that includes TS16949, 5s, GD&T, Geometric Dimensioning, Kaizen and more. Ryan Casanova has 1 emails and 2 mobile phone numbers on RocketReach.
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