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Ryan Casanova Location
Kalamazoo, MI, US
Ryan Casanova Work
2022 -now Technical Sales Engineer @
2021 -2022 Product Engineer @
2008 -2021 Product Engineer @
2006 -2008 Product Engineer @
Ryan Casanova Education
Western Michigan University
Bachelors (Mechanical Engineering)
2002-2005
Macomb Community College
(ENGINEERING)
2000-2002
Ryan Casanova Skills
TS16949
5s
GD&T
Geometric Dimensioning
Kaizen
PPAP
Automotive
APQP
SPC
FMEA
ISO/TS 16949
Manufacturing
Continuous Improvement
Geometric Dimensioning and Tolerancing
Manufacturing Engineering
Poka Yoke
Stamping
Ryan Casanova Summary
Ryan Casanova, based in Kalamazoo, MI, US, is currently a Technical Sales Engineer at Hexagon Manufacturing Intelligence. Ryan Casanova brings experience from previous roles at Shiloh Industries, Benteler Automotive and Trelleborg. Ryan Casanova holds a 2002 - 2005 Bachelors in Mechanical Engineering @ Western Michigan University. With a robust skill set that includes TS16949, 5s, GD&T, Geometric Dimensioning, Kaizen and more. Ryan Casanova has 1 emails and 2 mobile phone numbers on RocketReach.
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