Ryan Carroll Email & Phone Number
Vice President of Innovation and Engineering @ Clopay Service Company
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Ryan Carroll Location
- Loveland, OH, US
Ryan Carroll Work
- 2026 -now Vice President of Innovation and Engineering @
- 2023 -2026 Director of Product Development @
- 2016 -2026 Director New Product Development @ CornellCookson
- 2015 -2026 Director of Engineering @
- 2014 -2026 Engineering Manager @
- 2008 -2014 Principle Mechanical Engineer II @
- 2006 -2008 Mechanical Engineer @ Paragon Machinery Inc.
- 1999 -2006 Sr. Mechanical Engineer @
- 1996 -1999 Project Engineer @
Ryan Carroll Education
- University of Wisconsin - Platteville
Bachelor of Science (Mecahnical Engineering)
1991-1996
Ryan Carroll Skills
- Design of Experiments
- Minitab
- SolidWorks and AutoCAD Inventor
- Team Leadership
- Project Management
- Product Development
- Engineering
- Manufacturing
- R
- Six Sigma
- Lean Manufacturing
- Solidworks
- Injection Molding
- Plastics
- Sheet Metal
- Labview
- Cross-functional Team Leadership
- Product Design
- Mechanical Engineering
- Engineering Management
- Research and Development (R&D)
- Team Building
- Leadership
- Research And Development R&D
- Java
- Microsoft Excel
- Cross Functional Team Leadership
- Research and Development
Ryan Carroll Summary
- Ryan Carroll, based in Loveland, OH, US, is currently a Vice President of Innovation and Engineering at Clopay Corporation. Ryan Carroll brings experience from previous roles at Clopay Corporation, CornellCookson and The Cookson Company, Inc.. Ryan Carroll holds a 1991 - 1996 Bachelor of Science in Mecahnical Engineering @ University of Wisconsin - Platteville. With a robust skill set that includes Design of Experiments, Minitab, SolidWorks and AutoCAD Inventor, Team Leadership, Project Management and more. Ryan Carroll has 2 emails and 3 mobile phone numbers on RocketReach.
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