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Ryan Carroll Location
Loveland, OH, US
Ryan Carroll Work
Vice President of Innovation and Engineering @ (January 2026 - Present)
Director of Product Development @ (October 2023 - January 2026)
Director New Product Development @ CornellCookson (October 2016 - January 2026)
Director of Engineering @ (January 2015 - January 2026)
Engineering Manager @ (May 2014 - January 2026)
Principle Mechanical Engineer II @ (July 2008 - January 2014)
Mechanical Engineer @ Paragon Machinery Inc. (June 2006 - July 2008)
Sr. Mechanical Engineer @ (July 1999 - July 2006)
Project Engineer @ (July 1996 - June 1999)
Ryan Carroll Education
University of Wisconsin - Platteville
Bachelor of Science (Mecahnical Engineering)
1991-1996
Ryan Carroll Skills
Cross-functional Team Leadership
Design of Experiments
Engineering
Engineering Leadership
Engineering Management
Injection Molding
Labview
Lean Manufacturing
Manufacturing
Mechanical Engineering
Minitab
Plastics
Product Design
Product Development
Project Management
R
Research and Development (R&D)
Sheet Metal
Six Sigma
SolidWorks
SolidWorks and AutoCAD Inventor
Team Building
Team Leadership
Leadership
Research And Development R&D
Java
Microsoft Excel
Cross Functional Team Leadership
Research and Development
Ryan Carroll Summary
Ryan Carroll, based in Loveland, OH, US, is currently a Vice President of Innovation and Engineering at Clopay Corporation. Ryan Carroll brings experience from previous roles at Clopay Corporation, CornellCookson and The Cookson Company, Inc.. Ryan Carroll holds a 1991 - 1996 Bachelor of Science in Mecahnical Engineering @ University of Wisconsin - Platteville. With a robust skill set that includes Cross-functional Team Leadership, Design of Experiments, Engineering, Engineering Leadership, Engineering Management and more. Ryan Carroll has 2 emails and 3 mobile phone numbers on RocketReach.
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