Ryan Buck Email & Phone Number
Head of Hardware Engineering @ Lumafield
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Ryan Buck Location
- Cambridge, MA, US
Ryan Buck Work
- 2024 - now Head of Hardware Engineering @
- 2023 - 2024 Engineering Manager, Optical and Thermal Systems @
- 2022 - 2023 Optical Engineering Manager @
- 2018 - 2022 Engineering Manager, Optical Sensing HW @
- 2015 - 2018 Optical Sensing HW Engineer @
- 2014 - 2015 Hardware Development Engineer @ EC3
Ryan Buck Education
- Purdue University
Master of Science in Engineering (Electrical and Computer Engineering)
- Case Western Reserve University
Bachelor's Degree (Electrical and Electronics Engineering)
Ryan Buck Skills
- Electrical Engineering
- Electronics
- Analog Circuit Design
- Schematic Capture
- Microcontrollers
- C
- PCB Design
- LTSpice
- Matlab
- PLC Programming
- R&D
- Engineering
- Circuit Design
- Python
- Data Analysis
- Simulations
- Git
Ryan Buck Summary
- Ryan Buck, based in Cambridge, MA, US, is currently a Head of Hardware Engineering at Lumafield. Ryan Buck brings experience from previous roles at Formlabs and Apple. Ryan Buck holds a Master of Science in Engineering in Electrical and Computer Engineering @ Purdue University. With a robust skill set that includes Electrical Engineering, Electronics, Analog Circuit Design, Schematic Capture, Microcontrollers and more. Ryan Buck has 1 emails and 2 mobile phone numbers on RocketReach.
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Top Lumafield Employees
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Bill Cronin
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Washington, DC, US
Lindsay van Den Bergh
Head of Operations
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Scott Johnston
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Ryan Buck
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Cambridge, MA, US
Austin Carder
Head of Content
San Francisco, CA, US
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