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Ryan Althoff Location
Indianapolis, IN, US
Ryan Althoff Work
Design Manager @ (March 2026 - Present)
Designer @ (March 2025 - March 2026)
Packaging Optimization Engineer @ (February 2024 - December 2024)
Compressed Air Sales Specialist @ (February 2023 - January 2024)
Regional Design Specialist @ (October 2015 - January 2023)
Ryan Althoff Education
Indiana State University
Bachelor of Science (B.S.) (Packaging Technology)
1999-2004
Ryan Althoff Skills
Account Management
Arden Impact
ArtiosCAD
AutoCAD
CAPE
Communication
Continuous Improvement
Corrugated
Die Cutting
Flexo
Foam
Folding Cartons
Food Packaging
Graphic Design
Graphics
Illustrator
Layout
Lean Manufacturing
Manufacturing
Microsoft Office
POP Displays
Packaging
Packaging Engineering
Paper Industry
Plastics
Presentations
Project Management
Relationship Development
Retail Packaging
Sales
Skill Development
TOPS
Teamwork
Working Experience
Ryan Althoff Summary
Ryan Althoff, based in Indianapolis, IN, US, is currently a Design Manager at Opus Packaging. Ryan Althoff brings experience from previous roles at Buckeye Corrugated, Inc. (BCI), MAVPAK, INC., Atlas Machine & Supply, Inc and Premier Packaging, Inc. Ryan Althoff holds a 1999 - 2004 Bachelor of Science (B.S.) in Packaging Technology @ Indiana State University. With a robust skill set that includes Account Management, Arden Impact, ArtiosCAD, AutoCAD, CAPE and more. Ryan Althoff has 2 emails and 1 mobile phone numbers on RocketReach.
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