Ruiyang Liu's Location
Marquette, MI, US
Ruiyang Liu's Work
- Lead packaging engineer @ TeraDAR
- IC packaging engineer @ Apple
- Ph.D. student researcher @ Binghamton University
- Teaching assistant at the ME department @ Binghamton University
- Mechanical Engineering Intern @ Apple
- Undergrad research assistant @ Harbin Institute of Technology
- Intern @ 日月光封装测试（上海）有限公司
Ruiyang Liu's Education
- SUNY Binghamton
Doctor of Philosophy (Ph.D.) (Mechanical Engineering)
- Harbin Institute of Technology
B.Eng., Electronics Packaging Technology, Materials Science and Engineering
Ruiyang Liu's Skills
- Matlab
- Finite Element Analysis
- MEMS
- ANSYS
- Simulations
- Solid Mechanics
- Reliability Engineering
- Characterization
- Mechanical Engineering
- Materials
Ruiyang Liu's Summary
Ruiyang Liu, based in Marquette, MI, US, is currently a Lead packaging engineer at TeraDAR, bringing experience from previous roles at Apple and Thomas J. Watson School of Engineering and Applied Science, Binghamton Universit. Ruiyang Liu holds a Doctor of Philosophy (Ph.D.) in Mechanical Engineering @ SUNY Binghamton. With a robust skill set that includes Matlab, Finite Element Analysis, MEMS, ANSYS, Simulations and more, Ruiyang Liu contributes valuable insights to the industry. Ruiyang Liu has 1 email on RocketReach.
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