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Rui Chen. Location
Seattle, WA, US
Rui Chen. Work
2020 -now Sr. Innovation and Design Engineer @
2019 -now Innovation and Design Engineer @
2017 -2019 Process Engineer @ Amazon Logistics
2015 -2017 Packaging Engineer @
2015 -2017 Packaging Engineer @
2014 -2015 Global R and D Packaging Intern @
2014 -2014 Packaging Engineer Intern @
2013 -2013 Teaching Assistant @
2010 -2010 Packaging Intern @ United Paper Mills-Kymmene (Finnish) Corporation
2008 -2008 Summer Internship as Client Manager @
Rui Chen. Education
Michigan State University
Master's Degree (Packaging Science)
2011-2014
Lund University
Study Abroad (Packaging Logistic in Sweden)
2013-2013
Wuhan University
bachelor (Journalism)
2008-2011
Wuhan University
Bachelor (Package Engineering)
2007-2011
Rui Chen. Skills
Packaging
Lean Manufacturing
Illustrator
AutoCAD
ArtiosCAD
Graphic Design
Food Industry
Photoshop
Cape
Life Cycle Assessment
Supply Chain Management
Food Safety
CAD
Materials
Food Processing
Minitab
Microsoft Office
Testing
Rfid System Design
Cross Functional Team Leadership
Manufacturing
MS Project
Solidworks
Adobe Illustrator
Supply Chain
Packaging Design
Artios Cad
Perl
MySQL
Python
Java
C++
Software Development
JavaScript
Scalability
Distributed Systems
Scrum
Agile Methodologies
Software Engineering
Algorithms
HTML
Rui Chen. Summary
Rui Chen., based in Seattle, WA, US, is currently a Sr. Innovation and Design Engineer at Amazon. Rui Chen. brings experience from previous roles at Amazon, Amazon Logistics, The Hershey Company and Adept Packaging. Rui Chen. holds a 2011 - 2014 Master's Degree in Packaging Science @ Michigan State University. With a robust skill set that includes Packaging, Lean Manufacturing, Illustrator, AutoCAD, ArtiosCAD and more. Rui Chen. has 3 emails and 2 mobile phone numbers on RocketReach.
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