Roy Teo Email
Team Lead and Senior Staff Engineer Unit Process Development (Wire Bond) @ Infineon Technologies
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Roy Teo Location
- Muar, MY
Roy Teo Work
- 2022 -now Team Lead and Senior Staff Engineer Unit Process Development (Wire Bond) @
- 2019 -2022 Staff Engineer Unit Process Development (Wire Bond) @
- 2018 -2019 Team Lead (FOL) and Lead Process Engineer @
- 2015 -2018 Senior Process Engineer (Wire Bond) @
- 2012 -2015 Process Engineer (Wire Bond) @
Roy Teo Education
- Multimedia University
Bachelor of Engineering - BE (Mechanical Engineering)
Roy Teo Summary
- Roy Teo, based in Muar, MY, is currently a Team Lead and Senior Staff Engineer Unit Process Development (Wire Bond) at Infineon Technologies. Roy Teo brings experience from previous roles at Infineon Technologies and STMicroelectronics. Roy Teo holds a Bachelor of Engineering - BE in Mechanical Engineering @ Multimedia University. Roy Teo has 1 emails on RocketReach.
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