Roy Steinberg Email
IRCM Hardware Engineer @ Northrop Grumman
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Roy Steinberg Location
- Chicago, IL, US
Roy Steinberg Work
- IRCM Hardware Engineer @ (February 2025 - Present)
- IRCM Hardware Engineering Intern @ (June 2024 - February 2025)
- Founder @ RoysToysCo LLC (November 2022 - Present)
- RF Hardware Engineering Intern @ (June 2023 - August 2023)
- Mechanical Engineering and Testing Intern @ (May 2022 - August 2022)
- STEM Teacher and Mentor @ (June 2022 - July 2022)
Roy Steinberg Education
- University of Illinois Urbana-Champaign
Bachelor of Science - BS (Mechanical Engineering)
2020-2024 - Highland Park High School 2016-2020
Roy Steinberg Skills
- 3D Printing
- 3D Prototyping
- Accounting
- Advertising
- Autodesk Fusion 360
- Autodesk Inventor
- Entrepreneurship
- Fused Deposition Modeling (FDM)
- Interpersonal Skills
- Leadership
- Mechanical Engineering
- Product Design
- Product Development
- Python (Programming Language)
- Rapid Prototyping
- SOLIDWORKS
- Sales
- Siemens NX
- Stereolithography
- Ultimaker Cura
Roy Steinberg Summary
- Roy Steinberg, based in Chicago, IL, US, is currently a IRCM Hardware Engineer at Northrop Grumman. Roy Steinberg brings experience from previous roles at Northrop Grumman, RoysToysCo LLC and Metraflex. Roy Steinberg holds a 2020 - 2024 Bachelor of Science - BS in Mechanical Engineering @ University of Illinois Urbana-Champaign. With a robust skill set that includes 3D Printing, 3D Prototyping, Accounting, Advertising, Autodesk Fusion 360 and more. Roy Steinberg has 3 emails on RocketReach.
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