Ron Hirsch Email
Reliability and Failure Analysis @ Apple
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Ron Hirsch Location
- Israel
Ron Hirsch Work
- 2015 -now Reliability and Failure Analysis @
- 2011 -2015 Materials and Failure Analysis @
- 2010 -2011 R and D Engineer @
- 2008 -2010 R and D Engineer @
- 2005 -2008 Process Engineer @
Ron Hirsch Education
- Technion - Israel Institute of Technology
ME* (System Engineering)
2007-2009 - Technion - Israel Institute of Technology
BSc (Chemical Engineering)
2000-2005
Ron Hirsch Skills
- Semiconductors
- R&D
- Optics
- Thin Films
- Metrology
- PVD
- Characterization
- Systems Engineering
- Product Development
- Lithography
- SPC
- Process Engineering
- PECVD
- Manufacturing
- Process Integration
- Fiber Optics
- SEM
- X-ray
- XRF
- Adhesives
- Chemical Engineering
- ASTM standards
- Assembly Lines
- FTIR
- Ion Exchange
- Failure Analysis
- Protective Coatings
- Powder Coating
- MVR
- Spectrophotometry
- Profilometer
- Polishing
- Materials
- Plastics
- Plasma Etch
- Dry Etch
- Wet Chemical Etching
- Interferometry
- Soldering
- IPC
- Technology Transfer
- Matlab
- Labview
- COMSOL
- Color Measurement
- Sample Preparation
- Design of Experiments
- Refractometer
- Rubbers
- Sealants
- X Ray
Ron Hirsch Summary
- Ron Hirsch, based in Israel, is currently a Reliability and Failure Analysis at Apple. Ron Hirsch brings experience from previous roles at Motorola Solutions, Oree Advanced Illumination Solutions, Tessera and ColorChip. Ron Hirsch holds a 2007 - 2009 ME* in System Engineering @ Technion - Israel Institute of Technology. With a robust skill set that includes Semiconductors, R&D, Optics, Thin Films, Metrology and more. Ron Hirsch has 2 emails on RocketReach.
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