Robert Daily Email
Principal Engineer - Assembly and Packaging - R and D @ Pragmatic Semiconductor
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Robert Daily Location
- United Kingdom
Robert Daily Work
- 2024 -now Principal Engineer - Assembly and Packaging - R and D @
- 2019 -2024 Senior Principal Engineer - Assembly and Package Engineering @
- 2018 -2019 Deputy Director @ Aquantia
- 2017 -2018 Senior Section Manager - Process Integration Engineering @
- 2015 -2017 Engineering Section Manager @
- 2011 -2015 Research and Development Engineer 3D and 2.5D Packaging @
- 2010 -2011 Senior Engineer @
- 2003 -2010 Process Engineer @
- 2003 -2003 Equipment Engineer @ Philips Semiconductors Calamba
- 1997 -2003 Maintenance Technician @
Robert Daily Education
- Manuel S. Enverga University Foundation
Robert Daily Skills
- Semiconductors
- Design of Experiments
- Failure Analysis
- Semiconductor Industry
- SPC
- IC
- JMP
- FMEA
- Characterization
- Silicon
- Thin Films
- Product Engineering
- Microelectronics
- MEMS
- Yield
- Lean Manufacturing
- CMOS
- Research
- Process Integration
- Metrology
- Statistical Process Control Spc
- Java
- Statistical Process Control
Robert Daily Summary
- Robert Daily, based in United Kingdom, is currently a Principal Engineer - Assembly and Packaging - R and D at Pragmatic. Robert Daily brings experience from previous roles at Rambus, Aquantia and Amkor Technology, Inc.. Robert Daily holds a Manuel S. Enverga University Foundation. With a robust skill set that includes Semiconductors, Design of Experiments, Failure Analysis, Semiconductor Industry, SPC and more. Robert Daily has 1 emails on RocketReach.
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