Robert Daily Email
Principal Engineer - Assembly and Packaging - R and D @ Pragmatic Semiconductor
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Robert Daily Location
- United Kingdom
Robert Daily Work
- Principal Engineer - Assembly and Packaging - R and D @ (July 2024 - Present)
- Senior Principal Engineer - Assembly and Package Engineering @ (November 2019 - January 2024)
- Deputy Director @ Aquantia (August 2018 - October 2019)
- Senior Section Manager - Process Integration Engineering @ (July 2017 - July 2018)
- Engineering Section Manager @ (July 2015 - July 2017)
- Research and Development Engineer 3D and 2.5D Packaging @ (October 2011 - May 2015)
- Senior Engineer @ (July 2010 - October 2011)
- Process Engineer @ (August 2003 - July 2010)
- Equipment Engineer @ Philips Semiconductors Calamba (February 2003 - July 2003)
- Maintenance Technician @ (August 1997 - February 2003)
Robert Daily Education
- Manuel S. Enverga University Foundation
Bachelor of Science (BSc) (Mechanical Engineering)
Robert Daily Skills
- Semiconductors
- Design of Experiments
- Failure Analysis
- Semiconductor Industry
- SPC
- IC
- JMP
- FMEA
- Characterization
- Silicon
- Thin Films
- Product Engineering
- Microelectronics
- MEMS
- Yield
- Lean Manufacturing
- CMOS
- Research
- Process Integration
- Metrology
- Statistical Process Control Spc
- Java
- Statistical Process Control
Robert Daily Summary
- Robert Daily, based in United Kingdom, is currently a Principal Engineer - Assembly and Packaging - R and D at Pragmatic. Robert Daily brings experience from previous roles at Rambus, Aquantia and Amkor Technology, Inc.. Robert Daily holds a Bachelor of Science (BSc) in Mechanical Engineering @ Manuel S. Enverga University Foundation. With a robust skill set that includes Semiconductors, Design of Experiments, Failure Analysis, Semiconductor Industry, SPC and more. Robert Daily has 1 emails on RocketReach.
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