Application Packaging Manager @ (April 2014 - January 2019)
Senior Application Packaging Engineer @ (March 2014 - April 2014)
Application Packaging Engineer @ (September 2013 - March 2014)
SCCM Deployment Engineer @ (June 2013 - August 2013)
Application Packaging Engineer @ (January 2013 - January 2013)
Application Packaging Deployment Engineer @ (January 2012 - January 2012)
Packaging and Deployment Engineer @ (January 2006 - January 2012)
CAD Support Engineer @ AECOM (incorporating Davis Langdon, An AECOM Company) (January 2002 - January 2006)
Rick Slater Education
Leeds Beckett University
Bsc (Hons) (Civil Engineering)
1992-1996
Ashton on Mersey Secondary School 1984-1989
Rick Slater Skills
3D Studio Max
Admin Studio Application Repackaging
Agile Methodologies
App-V
AppV
Application Packaging
ArchiCAD
Architecture
Architectures
AutoCAD
Autodesk
Automation
BIM
Bentley Microstation
CAD
Citrix
Citrix XenApp
Design Management
Digital Transformation
EMCO repackaging
Emco
End to End Delivery
IT Management
ITIL
Infrastructure
Installshield Admin Studio
Leadership
Management
Master Packager
Mentoring
Microstation
Modeling
Navisworks
Office 365
Problem Solving
Process Design
Process Improvement
Revit
SCCM
Standard Operating Procedure (SOP)
Standards
System Center Configuration Manager (SCCM)
Team Leadership
Training
Virtualization
VmWare ThinApp 5.01
WSUS
Windows 10
Windows Server
XenApp
Packaging
App V
Support
System Center Configuration Manager Sccm
System Center Configuration Manager
Rick Slater Summary
Rick Slater, based in Manchester, England, GB, is currently a Senior Infrastructure Engineer at DWP Digital. Rick Slater brings experience from previous roles at DWP Digital, Agilisys, Computacenter and The Co-op. Rick Slater holds a 1992 - 1996 Bsc (Hons) in Civil Engineering @ Leeds Beckett University. With a robust skill set that includes 3D Studio Max, Admin Studio Application Repackaging, Agile Methodologies, App-V, AppV and more. Rick Slater has 2 emails on RocketReach.
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