Reed P. Email
Senior PWB Design Engineer @ Qualcomm
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Reed P. Location
- Taiwan
Reed P. Work
- Senior PWB Design Engineer @ (February 2025 - Present)
- Senior PCB Design Engineer ( Deputy Manager Level ) @ (November 2024 - February 2025)
- Senior PCB Design Engineer ( Section Leader Level ) @ (November 2021 - November 2024)
- Senior PCB Design Engineer @ (April 2019 - November 2021)
- PCB Design Engineer @ (September 2017 - April 2019)
- PCB Design Engineer @ Designwires Limited Corp. (August 2012 - August 2017)
- Jr. PCB Design Engineer @ (June 2009 - August 2012)
- R and D staff @ Yi-Phone Taiwan (March 2007 - February 2009)
- Production Line Leader @ (January 2006 - February 2007)
Reed P. Education
- Polytechnic University of the Philippines
Bachelor of Science
2000-2005 - Olongapo City National High School 1996-2000
Reed P. Skills
- Layout
- Troubleshooting
- Allegro
- Board Layout
- High Speed Design
- PCB design
- EDA
- SMT
- DDR3
- Assembly
- DDR2
- Engineering
- Electronics
- Manufacturing
- Product Development
Reed P. Summary
- Reed P., based in Taiwan, is currently a Senior PWB Design Engineer at Qualcomm. Reed P. brings experience from previous roles at Compal and Inventec. Reed P. holds a 2000 - 2005 Bachelor of Science @ Polytechnic University of the Philippines. With a robust skill set that includes Layout, Troubleshooting, Allegro, Board Layout, High Speed Design and more. Reed P. has 1 emails on RocketReach.
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