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Randall Parker Location
Boise, ID, US
Randall Parker Work
Senior Member of Technical Staff @ (July 2024 - Present)
Sr. Process and Assembly Engineer @ American Semiconductor, Inc. (April 2020 - June 2024)
Senior CMP Process Engineer @ (October 2018 - April 2020)
Senior Process Development Engineer @ (September 2017 - April 2020)
Process and Equipment Engineer @ (October 2003 - September 2017)
CMP Engineering Manager @ Union Semiconductor Technology Corporation (April 1999 - April 2003)
CMP Process Engineer @ (June 1996 - April 1999)
Randall Parker Education
University of Wisconsin-Madison
Master of Science - MS (Nuclear Engineering & Engineering Physics)
1993-1995
Rensselaer Polytechnic Institute
Bachelor of Science - BS (Engineering Physics)
1989-1993
Randall Parker Skills
Semiconductor Industry
Semiconductors
Design of Experiments
IC
CMP
Electronics
Dry Etch
SPC
Process Development
Metrology
Manufacturing
JMP
Capital Equipment
Engineering
Wafer Thinning
Silicon
Wafer Bonding
Randall Parker Summary
Randall Parker, based in Boise, ID, US, is currently a Senior Member of Technical Staff at DISCO HI-TEC AMERICA, INC.. Randall Parker brings experience from previous roles at American Semiconductor, Inc. and Micron Technology. Randall Parker holds a 1993 - 1995 Master of Science - MS in Nuclear Engineering & Engineering Physics @ University of Wisconsin-Madison. With a robust skill set that includes Semiconductor Industry, Semiconductors, Design of Experiments, IC, CMP and more. Randall Parker has 3 emails and 2 mobile phone numbers on RocketReach.
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