2022 -2025 Principal Engineer @ Huawei Japan Yokohama Research Center
2016 -2018 特任研究員 @
Ran HE Education
東京大学
博士 (精密工学)
2012-2016
University of Chinese Academy of Sciences
Master's Degree (TSVs filling for 3D IC)
2009-2012
Huazhong University of Science and Technology
Bachelor's Degree (Electronic Sci. & Tech.)
2005-2009
Ran HE Skills
3D Integration
Simulations
XPS
Semiconductors
Sem/Tem
Research
AFM
Thin Films
Materials Science
Tsvs
Characterization
Nanotechnology
Wafer Bonding
Ran HE Summary
Ran HE, based in Tokyo, JP, is currently a Semiconductor Technology Expert at 華为. Ran HE brings experience from previous roles at Huawei Japan Yokohama Research Center and 東京大学. Ran HE holds a 2012 - 2016 博士 in 精密工学 @ 東京大学. With a robust skill set that includes 3D Integration, Simulations, XPS, Semiconductors, Sem/Tem and more. Ran HE has 2 emails on RocketReach.
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