Ram Vadlamani Email & Phone Number
R and D Packaging Engineer and Pathfinding - Panel Level Packaging @ Intel Corporation
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Ram Vadlamani Location
- Chandler, AZ, US
Ram Vadlamani Work
- 2024 -now R and D Packaging Engineer and Pathfinding - Panel Level Packaging @
- 2022 -2024 R and D Packaging Engineer - Chip to Wafer (Interposer) Attach @
- 2022 -2022 Principal Engineer @
- 2019 -2022 Postdoctoral Research Associate @
- 2021 -2022 NSF and FDA Scholar-in-Residence @
- 2018 -2019 Engineering Consultant @
- 2013 -2018 Doctoral Researcher @
- 2013 -2017 Teaching Assistant, PUR-1 Reactor Facility and Radiation Labs @
- 2014 -2014 Teaching Assistant, Engineering Mathematics Using Mathematica @
- 2011 -2013 Graduate Research Assistant, Multiphase Flows Lab @
- 2013 -2013 Teaching Assistant, Thermal Hydraulics Lab @
- 2010 -2011 Programmer Analyst Trainee @
- 2009 -2009 Student Intern @
- 2008 -2008 Manufacturing Intern @
Ram Vadlamani Education
- Purdue University
Doctor of Philosophy (PhD) (Nuclear Engineering)
2013-2018 - Purdue University
Master's degree (Nuclear Engineering)
2011-2013 - Chaitanya Bharathi Institute Of Technology
Bachelor of Engineering (BEng) (Mechanical Engineering)
2006-2010
Ram Vadlamani Summary
- Ram Vadlamani, based in Chandler, AZ, US, is currently a R and D Packaging Engineer and Pathfinding - Panel Level Packaging at Intel Corporation. Ram Vadlamani brings experience from previous roles at Intel Corporation, Galvanize Therapeutics, Inc., Virginia Tech and FDA. Ram Vadlamani holds a 2013 - 2018 Doctor of Philosophy (PhD) in Nuclear Engineering @ Purdue University. Ram Vadlamani has 2 emails and 1 mobile phone numbers on RocketReach.
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