Ram Paul Email & Phone Number
Principal Engineer @ Cook Advanced Technologies
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Ram Paul Location
- Bloomington, IN, US
Ram Paul Work
- Principal Engineer @ (January 2022 - Present)
- Senior Research Engineer @ (January 1992 - February 2022)
- President and Chief Executive Officer @ Bypass Systems (September 1986 - June 1992)
- Student and Researcher @ (June 1976 - July 1986)
Ram Paul Education
- University Of Maryland - College Park
Ram Paul Skills
- Bioengineering
- Biomaterials
- Biomedical Engineering
- Biotechnology
- Capital Equipment
- Catheters
- Commercialization
- Cross-functional Team Leadership
- Design Control
- Design for Manufacturing
- Design of Experiments
- Drug Delivery
- FDA
- FMEA
- Finite Element Analysis
- GMP
- ISO 13485
- ISO 14971
- Injection Molding
- Intellectual Property
- Labview
- Lifesciences
- Manufacturing
- Market Development
- Materials Science
- Mechanical Testing
- Medical Device R&D
- Medical Devices
- Medical Imaging
- Minitab
- Nanotechnology
- Orthopedic
- Patents
- Polymer Chemistry
- Polymers
- Process Simulation
- Product Development
- Product Launch
- Quality System
- R&D
- Rapid Prototyping
- Regulatory Affairs
- Scanning Electron Microscopy
- Solidworks
- Stents
- Surgical Instruments
- Technology Transfer
- Tissue Engineering
- V&V
- Validation
Ram Paul Summary
- Ram Paul, based in Bloomington, IN, US, is currently a Principal Engineer at Cook Advanced Technologies. Ram Paul brings experience from previous roles at Cook Medical, Bypass Systems and National Institutes of Health. Ram Paul holds a University Of Maryland - College Park. With a robust skill set that includes Bioengineering, Biomaterials, Biomedical Engineering, Biotechnology, Capital Equipment and more. Ram Paul has 3 emails and 1 mobile phone numbers on RocketReach.
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