Master of Business Administration (Business Administration and Management, General)
2015 - 2017
Illinois Institute of Technology
MS (Telecommunications & Software Engineering)
1997 - 1999
Motilal Nehru National Institute Of Technology
BE (Computer Science)
1989 - 1993
Rajeev Pal Skills
Embedded Systems
Wireless
Software Development
Embedded Software
Software Engineering
C
RTOS
LTE
Mobile Devices
C++
Rajeev Pal Summary
Rajeev Pal, based in California, United States, is currently a Vice President Of Engineering at Qualcomm, Inc. Rajeev Pal brings experience from previous roles at Motorola India Electronics Ltd and Bharat Electronics Limted. Rajeev Pal holds a 2020 - 2021 Postgraduate Diploma in Machine Learning & Artificial Intelligence @ Columbia University. With a robust skill set that includes Embedded Systems, Wireless, Software Development, Embedded Software, Software Engineering and more. Rajeev Pal has 3 emails and 1 mobile phone numbers on RocketReach.
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