Rajarshi Das's Location
Hershey, PA, US
Rajarshi Das's Work
- Global Head - Packaging Innovation R and D @ The Hershey Company
- Sr. Manager - Packaging Innovation @ Coty
- Manager, Global Packaging Innovation @ PepsiCo
- Sr. Packaging Engineer - Breakthrough Innovation (Global Packaging) @ Campbell Soup Company
- Product Development Engineer @ Fres-co System USA, Inc.
- Process Engineer @ Sonoco
- Assistant Manager - Technical Service @ Siegwerk
- Printing Engineer @ The Paper Products Ltd
Rajarshi Das's Education
- Kellogg Executive Education
Shaping innovation leaders
- Michigan State University
MS (Packaging)
2001 - 2003 - Anna University
Bachelor of Engineering (Printing Technology)
1993 - 1997
- Kendriya Vidyalaya
Rajarshi Das's Skills
- Packaging Engineering
- Manufacturing
- Continuous Improvement
- Packaging
- Food Packaging
- Plastics
- Product Development
- Six Sigma
- Quality System
- Materials
Rajarshi Das's Summary
Rajarshi Das, based in Hershey, PA, US, is currently a Global Head - Packaging Innovation R and D at The Hershey Company, bringing experience from previous roles at Coty, PepsiCo, Campbell Soup Company and Fresco Systems USA. Rajarshi Das holds a Shaping innovation leaders @ Kellogg Executive Education. With a robust skill set that includes Packaging Engineering, Manufacturing, Continuous Improvement, Packaging, Food Packaging and more, Rajarshi Das contributes valuable insights to the industry. Rajarshi Das has 7 emails and 1 mobile phone number on RocketReach.
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