Rainer Lepik Email
Engineering Lead @ Comodule
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Rainer Lepik Location
- Tallinn, EE
Rainer Lepik Work
- 2025 -now Engineering Lead @
- 2022 -2025 Product Lead, Hardware @
- 2020 -2022 Product Owner @
- 2019 -2020 Product and Team lead for Sharing Systems @
- 2017 -2019 Project Manager @
- 2015 -2017 Formula Student Team Tallinn Manager @
- 2015 -2017 Mechanical Engineer @
- 2011 -2014 Engineer @
Rainer Lepik Education
- Tallinna Tehnikaülikool
Master's degree (Design and Engineering)
2015-2017 - TalTech – Tallinn University of Technology
Bachelor's degree (Mechatronics, Robotics, and Automation Engineering)
2011-2014 - RWTH Aachen University
Erasmus Exchange Program
2012-2013 - Tallinn Secondary Science School
High School (Real Sciences)
2008-2011
Rainer Lepik Summary
- Rainer Lepik, based in Tallinn, EE, is currently a Engineering Lead at Comodule. Rainer Lepik brings experience from previous roles at Comodule. Rainer Lepik holds a 2015 - 2017 Master's degree in Design and Engineering @ Tallinna Tehnikaülikool. Rainer Lepik has 2 emails on RocketReach.
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