Rahima Mohammed Email & Phone Number

Rahima Mohammed Skills

• Semiconductors
• Simulations
• SoC
• EDA
• VLSI
• ASIC
• IC
• FPGA
• Computer Architecture
• Verilog
• Debugging
• Embedded Systems
• Processors
• Microprocessors
• Hardware Architecture
• Intel
• Cross-functional Team Leadership
• Mechanical Engineering
• Design for Manufacturing
• Thermal Engineering
• Integrated Circuits (IC)
• Leadership
• Manufacturing Engineering
• System on a Chip (SoC)
• 3DIC Packaging
• AI/ML Integration into Validation at Scale
• AI/ML for Validation
• Advanced Cooling (Air, Liquid, Vapor Chamber, Cold Plate)
• Board‑Level Thermal Management
• Co‑Package Optics
• Cross-functional Team Leadership across 10+ geos
• Custom SKU Validation
• Customer Debug
• Customer-First Debug, Data Traceability and Automation
• Data Center Systems Architecture
• Diversity Advocacy
• Engineering Management
• Executive Influence
• Global Advocacy for Women in Engineering & DEI
• Global Mentorship
• IC Packaging Reliability (BGA, Flip‑Chip, 2.5D/3D)
• Inclusive Team Building
• Leadership Development
• Leadership Development & Technical Talent Acceleration
• Multiphysics Modeling
• ODM/Supplier Collaboration and Mangement
• Physics Intelligence
• Post-Silicon Debug & Validation Strategy
• Post‑Silicon Validation
• Power thermal performance validation
• Power‑Thermal Performance Validation
• Rack‑Level Thermal Management
• Roadmap Strategy
• Second-level Interconnect, and Platform Architecture
• Silicon Readiness
• Simulation‑to‑Silicon Thermal Correlation
• Soft Skills and interpersonal skills
• System‑Level Thermal Management
• Technical Talent Acceleration
• Thermal Architecture
• Thermal Management and Margining tools
• Traceability Automation
• Workload‑Specific Validation
• Cross Functional Team
• Oracle
• Integrated Circuits Ic
• Engineering
• Public Speaking
• Strategic Planning
• Cross Functional Team Leadership
• Architecture
• System on a Chip Soc
• Integrated Circuits
• System on a Chip