Qing Yang Email & Phone Number
Principal Wafer Fab Metrology Engineer @ Nokia
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Qing Yang Location
- Union City, CA, US
Qing Yang Work
- Principal Wafer Fab Metrology Engineer @ (June 2026 - Present)
- Principal Metrology Engineer @ (November 2023 - Present)
- Materials Scientist + Metrology Lead @ (November 2017 - August 2023)
- Materials Scientist @ (November 2015 - November 2017)
- Postdoctoral Fellow @ (September 2014 - November 2015)
- Graduate Research Assistant @ (January 2010 - August 2014)
- Undergraduate Student Mentor @ (May 2012 - August 2013)
- Teaching Assistant @ (September 2009 - December 2009)
- Board Member @ (April 2013 - June 2014)
- Undergraduate Research Assistant @ Laboratory for Advanced Functional Thin Film Materials (September 2008 - June 2009)
- Hospitality Staff Coordinator @ (February 2008 - August 2008)
- Undergraduate Research Assistant @ Laboratory for Corrosion, Erosion and Surface Technology (June 2007 - June 2008)
Qing Yang Education
- Michigan State University
Doctor of Philosophy (PhD) (Materials Science and Engineering)
2009-2014 - University of Science and Technology Beijing
B.S. (Materials Physics)
2005-2009
Qing Yang Skills
- Injection Molding
- Physics
- Spectroscopy
- Glycine Nitrate Process
- Alloys And Ceramics
- Plating
- Planning
- Colloidal Spray Deposition
- Uniaxial And Isostatic Pressing
- Ceramic Processing
- Scanning Electron Microscopy
- X Ray Tomography
- Powder X Ray Diffraction
- Matlab
- Polymer Composites
- Chinese
- Sol Gel
- Data Analysis
- Mimics
- Materials
- Engineering
- Thin Films
- COMSOL
- Strategy
- Characterization
- Research And Development R&D
- Microsoft Excel
- Mechanical Testing
- Avizo
- Electro Chemical Impedance Spectroscopy Eis
- Comsol Multiphysics
- Focused Ion Beam Fib 3D Reconstruction
- Polymers
- Stress Analysis
- Electrochemistry
- Thermo Gravimetric Analysis Tga
- Solidworks
- X Ray Diffraction Xrd
- Materials Scientist
- Mathematica
- Digital Image Processing
- Dilatometry
- Materials Science
- Nanotechnology
- AMR
- Solid State
- Consulting
- Chemical
- Rig
- Vendors
- Community
- Undergraduate
- Sputtering
- Corrosion
- Ecs
- Impedance Spectroscopy
- Students
- Lodging
- Strain
- I V
- Magnesium
- Market Research
- Mentoring
- Evolution
- Image Processing
- Structure
- Coatings
- Coupling
- Executive Positions
- Minitab
- Programming
- Executive Support
- Sbir
- Particle
- Stress
- Sintering
- Microstructure
- Prediction
- Treatment
- Erosion
- Procurement
- Film
- Management
- Design
- Vacancy
- Science
- Introductory
- Hp Enterprise Solutions
- Shear
- InDesign
- Spray
- Beijing
- Pressing
- Publications
- Source
- Adobe
- Guidance
- Photoshop
- Networking
- Instrumentation
- Milling
- Troubleshooting
- Automotive
- 3D Printing
- Cell
- Trade Unions
- Visualization
- Image Reconstruction
- TEM
- Membrane
- Traditional Animation
- In Situ
- Engineering Process
- Reaching
- Microsoft Office
- Property
- Transportation
- Testing
- Training
- Performance Engineering
- Image Acquisition
- Research
- Thick Film
- Commercial Real Estate
- Wafer
- ImageJ
- Analysis
- Hardness
- Microscopy
- Mechanisms
- Computed Tomography
- Laboratory
- Thermo
- R
- Probe
- Gas Chromatography
- Sports
- Layers
- C
- Poster Presentations
- Fuel
- Applications
- Chemical Engineering
- Mechanical
- Communication
- Home
- Mechanical Properties
- Composites
- Origin
- Abaqus
- Energy
- Active
- TGA
- Profilometer
- Safety
- Nano
- Digital Imaging
- Comparative
- Finite Element Analysis
- Oxygen
- Diffraction
- FIB
- Electrolytes
- Failure Analysis
- Project
- Measurements
- Surface
- XPS
- Impedance
- Electro
- Magneto
- Alloys
- Heat Treatment
- Flash
- Iron
- Attrition
- International
- X Ray
- Programmable Logic
- Art
- 3D reconstruction
- Relaxation
- Illustrator
- Oxides
- Screen Printing
- Heat
- Tomography
- Logic Synthesis
- Porosity
- Microsoft Exchange
- Electronics
- Connectivity
- Jets
- Bridge Inspection
- Software
- Bulk
- Ping
- Berkeley
- Resistance
- Ceramic
- Hospitality
- Structural Engineering
- Organizational Behavior
- China
- Ellipsometry
- SEM
- Arranging
- Light
- Financial Transactions
- CCU
- Research Projects
- Olympic
- Materials Research
- North American
- Evaluation
- Commercialization
- Process Optimization
- Focused Ion Beam 3d Reconstruction
- Electro Chemical Impedance Spectroscopy
- Thermo Gravimetric Analysis
- X Ray Diffraction
- Research and Development
Qing Yang Summary
- Qing Yang, based in Union City, CA, US, is currently a Principal Wafer Fab Metrology Engineer at Nokia. Qing Yang brings experience from previous roles at Diamond Foundry, Leia Inc., Nanolab Technologies and Advanced Light Source, Lawrence Berkeley National Laboratory. Qing Yang holds a 2009 - 2014 Doctor of Philosophy (PhD) in Materials Science and Engineering @ Michigan State University. With a robust skill set that includes Injection Molding, Physics, Spectroscopy, Glycine Nitrate Process, Alloys And Ceramics and more. Qing Yang has 3 emails and 3 mobile phone numbers on RocketReach.
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Qing Yang
Principal Wafer Fab Metrology Engineer
Union City, CA, US
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Manager, Software Engineering
California, United States
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