Phillip le Email & Phone Number
Technical Packaging Manager @ Haleon
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Phillip le Location
- Warren, NJ, US
Phillip le Work
- Technical Packaging Manager @ (September 2026 - Present)
- Sr. Manager, R and D Packaging Engineer @ (July 2021 - September 2026)
- Program Manager, R and D Packaging Engineer @ (September 2019 - July 2021)
- Program Manager, R and D Packaging Development Engineer @ (May 2019 - September 2019)
- Sr. R and D Packaging Development Engineer @ (October 2014 - April 2019)
- Sr. R and D Packaging Development Engineer @ (January 2013 - October 2014)
- Packaging Engineer @ (September 2003 - December 2012)
- Packaging Engineer Consultant @ (January 1999 - August 2003)
Phillip le Education
- Penn State University
Bachelor's degree (Mechanical Engineering)
1994-1999
Phillip le Skills
- Communication
- Transparency
Phillip le Summary
- Phillip le, based in Warren, NJ, US, is currently a Technical Packaging Manager at Haleon. Phillip le brings experience from previous roles at Beiersdorf and Bayer Pharmaceuticals. Phillip le holds a 1994 - 1999 Bachelor's degree in Mechanical Engineering @ Penn State University. With a robust skill set that includes Communication, Transparency and more. Phillip le has 2 emails and 2 mobile phone numbers on RocketReach.
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