If you need more lookups,
subscriptions start at $34 USD/month.
Phillip Barker Location
Columbus, OH, US
Phillip Barker Work
Design Engineer @ (December 2023 - Present)
Analog Design Engineering Intern @ (August 2022 - February 2024)
Electrical Engineering Intern @ Area-I (May 2022 - August 2022)
3D Printer Technican @ (August 2021 - August 2022)
Electrical Engineering Intern @ Area-I (May 2021 - August 2021)
Sales Associate-DIY @ (August 2019 - August 2021)
Phillip Barker Education
The Ohio State University
Bachelor of Applied Science - BASc (Electrical and Electronics Engineering)
2019-2023
Kent State University at Tuscarawas
Associate's of Applied Science (Electrical and Electronics Engineering Technology)
2016-2019
Phillip Barker Summary
Phillip Barker, based in Columbus, OH, US, is currently a Design Engineer at SenseICs Corporation. Phillip Barker brings experience from previous roles at SenseICs, Area-I and IC3D Printers. Phillip Barker holds a 2019 - 2023 Bachelor of Applied Science - BASc in Electrical and Electronics Engineering @ The Ohio State University. Phillip Barker has 2 emails on RocketReach.
Looking for a different Phillip Barker?
Find contact details for 700 million professionals.