Philip Heil Email & Phone Number
Individual Contributor @ Intel Corporation
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Philip Heil Location
- Scappoose, OR, US
Philip Heil Work
- Individual Contributor @ (August 2019 - Present)
- Senior Module Engineer @ (February 2013 - August 2019)
- Postdoctoral Research Associate @ (November 2012 - January 2013)
- Visiting Lecturer @ (August 2012 - January 2013)
- Graduate Research Assistant @ (May 2006 - August 2012)
- Research Scientist @ (November 2010 - September 2011)
- Undergraduate Assistant @ (May 2004 - May 2006)
- Production Assistant and Technical Consultant @ National Engravers, Inc. (May 1999 - September 2003)
Philip Heil Education
- University of Illinois at Urbana-Champaign
Ph.D. (Materials Science and Engineering)
2006-2012 - University of Illinois at Urbana-Champaign
Bachelor of Science (Materials Science and Engineering, Electronic materials)
2002-2006
Philip Heil Skills
- Engineering
- Project Engineering
- Technical Consultant
- Data Analysis
- Statistics
- Molecular Cloning
- Undergraduate
Philip Heil Summary
- Philip Heil, based in Scappoose, OR, US, is currently a Individual Contributor at Intel Corporation. Philip Heil brings experience from previous roles at Intel Corporation and University of Illinois at Urbana-Champaign. Philip Heil holds a 2006 - 2012 Ph.D. in Materials Science and Engineering @ University of Illinois at Urbana-Champaign. With a robust skill set that includes Engineering, Project Engineering, Technical Consultant, Data Analysis, Statistics and more. Philip Heil has 3 emails and 1 mobile phone numbers on RocketReach.
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