Philip Chung Email & Phone Number
Member of Technical Staff, Hardware @ Density AI
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Philip Chung Location
- Mountain View, CA, US
Philip Chung Work
- Member of Technical Staff, Hardware @ (June 2025 - Present)
- Senior Microelectronics Packaging Engineer @ Boeing Research & Technology (August 2024 - June 2025)
- Senior Process Engineer @ (August 2021 - July 2024)
- Senior Research And Development Engineer @ (April 2020 - July 2021)
- Research And Development Engineer @ (December 2017 - March 2020)
- Graduate Research Assistant @ (June 2015 - August 2017)
- Technical Engineering Intern @ (May 2016 - August 2016)
Philip Chung Education
- Georgia Institute of Technology
Master of Science - MS (Mechanical Engineering)
2015-2017 - Georgia Institute of Technology
Bachelor of Science - BS (Mechanical Engineering)
2011-2015
Philip Chung Skills
- 3D Computer Aided Design (3D CAD)
- ANSYS
- DFA
- DFX
- Design for Manufacturing
- Failure Analysis
- Finite Element Analysis (FEA)
- Mechanical Engineering
- Process Integration
- Root Cause Analysis
- Semiconductor Packaging
Philip Chung Summary
- Philip Chung, based in Mountain View, CA, US, is currently a Member of Technical Staff, Hardware at DensityAI. Philip Chung brings experience from previous roles at Boeing Research & Technology, SpaceX and TSMC. Philip Chung holds a 2015 - 2017 Master of Science - MS in Mechanical Engineering @ Georgia Institute of Technology. With a robust skill set that includes 3D Computer Aided Design (3D CAD), ANSYS, DFA, DFX, Design for Manufacturing and more. Philip Chung has 2 emails and 2 mobile phone numbers on RocketReach.
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