Phil Lafleur Email

Phil Lafleur Email

Vice President Hardware Engineering @ ORBCOMM

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Phil Lafleur's Location

Ottawa, ON, CA

Phil Lafleur's Work

Phil Lafleur's Education

  • Carleton University

    Master's (Electrical Engineering)

    1996 - 1998

Phil Lafleur's Skills

  • Wireless
  • RF
  • Telecommunications
  • PCB design
  • Embedded Systems
  • Engineering Management
  • Testing
  • Hardware Architecture
  • Manufacturing
  • Product Development

Phil Lafleur's Summary

Phil Lafleur, based in Ottawa, ON, CA, is currently a Vice President Hardware Engineering at ORBCOMM, bringing experience from previous roles at Resonance Microwave Systems Inc., Flextronics, DAP Technologies and iDirect. Phil Lafleur holds a 1996 - 1998 Master's in Electrical Engineering @ Carleton University. With a robust skill set that includes Wireless, RF, Telecommunications, PCB design, Embedded Systems and more, Phil Lafleur contributes valuable insights to the industry. Phil Lafleur has 2 emails on RocketReach.
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