Phil Germann's Location
Austin, TX, US
Phil Germann's Work
- Hardware Engineering Manager @ Intel Capital
- Senior Manager, Processor Implementation @ LSI, an Avago Technologies Company
- Senior Manager, Custom Microprocessor Integration and Timing @ IBM Security
- Senior Signal Integrity and Packaging Engineer @ IBM Security
- Co-op @ 3M
Phil Germann's Education
- University of Minnesota-Twin Cities
MS (Electrical Engineering)
- South Dakota State University
BS (Engineering Physics)
Phil Germann's Skills
- Electrical Engineering
- Hardware Design
- Signal Integrity
- Chip Packaging
- System Design
- System Floorplanning
- Electrical Modeling and Simulation
- Power Distribution Analysis
- Hardware Characterization and Measurement
- Interface Budgeting and Timing
Phil Germann's Summary
Phil Germann, based in Austin, TX, US, is currently a Hardware Engineering Manager at Intel Corporation, bringing experience from previous roles at LSI, an Avago Technologies Company, IBM and 3M. Phil Germann holds a MS in Electrical Engineering @ University of Minnesota-Twin Cities. With a robust skill set that includes Electrical Engineering, Hardware Design, Signal Integrity, Chip Packaging, System Design and more, Phil Germann contributes valuable insights to the industry. Phil Germann has 3 emails on RocketReach.
5 free lookups per month.
Not the Phil Germann you were looking for?
Find contact details for 700 million professionals.
Others Named Phil Germann
-
1
-
35
-
11
-
11
Top Intel Capital Employees
-
31
-
42
-
5+5+
-
ViewJennifer Ard
Managing Director, Head of Investment Operations at Intel Capital
Salt Lake City, UT, US43 -
44
-
31
-
25+
-
35+
-
5+4
-
35+
-
31
-
25+
-
12
-
31
-
32
How It Works
Get a Free Account
Sign up for a free account. No credit card required. Up to 5
free lookups / month.
Search
Search over 700
million verified professionals across 35 million companies.
Get Contact Info
Get contact details including emails and phone numbers
(business & personal).
G2Crowd Trusted
300K+
Plugin Users
