Phil Germann Email & Phone Number
All Cores Engineering: Full Chip Physical Design @ Intel Corporation
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Phil Germann Location
- Austin, TX, US
Phil Germann Work
- All Cores Engineering: Full Chip Physical Design @ (January 2025 - Present)
- Network Hardware Engineering @ (November 2014 - December 2024)
- Senior Manager, Processor Implementation @ (July 2013 - November 2014)
- Senior Manager, Custom Microprocessor Integration and Timing @ (April 2011 - June 2013)
- Senior Signal Integrity and Packaging Engineer @ (May 1997 - April 2011)
Phil Germann Education
- South Dakota State University
BS (Engineering Physics)
- University of Minnesota
MS (Electrical Engineering)
Phil Germann Skills
- Electrical Engineering
- Hardware Design
- Signal Integrity
- Chip Packaging
- System Design
- System Floorplanning
- Electrical Modeling and Simulation
- Power Distribution Analysis
- Hardware Characterization and Measurement
- Interface Budgeting and Timing
- Supplier Evaluation
- Design for Manufacturing
- Design Review
- Project Planning
- Resource Estimation
- People Management
- Team Leadership
- Leadership Mentoring
- Chip Physical Design
- Chip Timing
- ARM
- ARM Architecture
- ASIC
- Analog
- Application-Specific Integrated Circuits (ASIC)
- CMOS
- Characterization
- Circuit Design
- Computer Hardware
- Debugging
- Electronics
- Hardware
- Hardware Architecture
- IC
- Integrated Circuits (IC)
- Integration
- Management
- Microprocessors
- Patent Development
- Patents
- Physical Design
- Program Management
- Project Management
- Publication Writing
- Semiconductors
- Systems Engineering
- Timing Closure
- Development
- Packaging
- IP
- Integrated Circuits Ic
- Power Distribution
- Application Specific Integrated Circuits Asic
- Electrical Modeling
- Design
- Interface Budgeting
- Electronic Products
- Application Specific Integrated Circuits
- Integrated Circuits
Phil Germann Summary
- Phil Germann, based in Austin, TX, US, is currently a All Cores Engineering: Full Chip Physical Design at Intel Corporation. Phil Germann brings experience from previous roles at Intel Corporation, LSI, an Avago Technologies Company and IBM. Phil Germann holds a BS in Engineering Physics @ South Dakota State University. With a robust skill set that includes Electrical Engineering, Hardware Design, Signal Integrity, Chip Packaging, System Design and more. Phil Germann has 3 emails and 1 mobile phone numbers on RocketReach.
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