Peter Tarantino Email & Phone Number
Module Development Staff Engineer - Thin Films: Chemical Vapor Deposition (CVD) @ Intel Corporation
Peter Tarantino's Location
New Mexico, United States
Peter Tarantino's Work
- Module Development Staff Engineer - Thin Films: Chemical Vapor Deposition (CVD) @ Intel Corporation
- Staff Engineer - ASH Dry Etch Process Engineering @ Intel Corporation
- Staff Engineer - Plasma Etch Process Engineering @ Intel Corporation
- Engineering Group Leader - Thin Films PECVD @ Intel Corporation
- Staff Engineer - Fab11x Metals Group - Cu Seed Barrier (CSB) @ Intel Corporation
- Engineering Group Leader - 248nm and 193nm Photolithography Group (Scanners and Tracks) @ Intel Corporation
- Staff Technologist - Photolithography 193nm Laser Scanners @ Intel Corporation
- Senior Engineer - Photolithography @ Intel Corporation
- Senior Engineering Technician - Photolithography @ Intel Corporation
- Process Engineering Technician - Lithography @ Intel Corporation
Peter Tarantino's Education
- Healds Institute of Technology
Associate's Science Electronics Engineering Technology (ASEET) (Electrical and Electronics Engineering)
1982 - 1984
Peter Tarantino's Skills
- 24 Yrs Photolithography
- Semiconductors
- Semiconductor Industry
- Design of Experiments
- Silicon
- Process Simulation
- IC
- SPC
- Semiconductor Process Technology
- 5 Yrs Dry Etch
Peter Tarantino's Summary
Peter Tarantino, based in New Mexico, United States, is currently a Module Development Staff Engineer - Thin Films: Chemical Vapor Deposition (CVD) at Intel Corporation, bringing experience from previous roles at Intel Corporation. Peter Tarantino holds a 1982 - 1984 Associate's Science Electronics Engineering Technology (ASEET) in Electrical and Electronics Engineering @ Healds Institute of Technology. With a robust skill set that includes 24 Yrs Photolithography, Semiconductors, Semiconductor Industry, Design of Experiments, Silicon and more, Peter Tarantino contributes valuable insights to the industry.
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