Peter Pi Email
Packaging Engineer @ Compal
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Peter Pi Location
- Taoyuan City, Taiwan, Taiwan
Peter Pi Work
- 2019 -now Packaging Engineer @
- 2011 -2019 Structure Engineer @
Peter Pi Education
- De Montfort University
Master (Design Innovation)
2009-2010 - National Yunlin University of Science and Technology
Bachelor (Industrial Design)
2001-2004
Peter Pi Skills
- Corrugated
- Packaging
- Product Development
- 3D rendering
- Product Design
- Packaging Engineering
- ArtiosCAD
- 3D Modeling
- Design Strategy
- Concept Development
- Retail Packaging
- Design for Manufacturing
- Pre-press
- Flexo
- Print Management
- Pre Press
Peter Pi Summary
- Peter Pi, based in Taoyuan City, Taiwan, Taiwan, is currently a Packaging Engineer at Compal Electronics, Inc.. Peter Pi brings experience from previous roles at YFYJupiter. Peter Pi holds a 2009 - 2010 Master in Design Innovation @ De Montfort University. With a robust skill set that includes Corrugated, Packaging, Product Development, 3D rendering, Product Design and more. Peter Pi has 1 emails on RocketReach.
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