National Yunlin University of Science and Technology
Bachelor (Industrial Design)
2001
-
2004
Peter Pi Skills
Corrugated
Packaging
Product Development
3D rendering
Product Design
Packaging Engineering
ArtiosCAD
3D Modeling
Design Strategy
Concept Development
Retail Packaging
Design for Manufacturing
Pre-press
Flexo
Print Management
Pre Press
Peter Pi Summary
Peter Pi, based in Taoyuan City, Taiwan, Taiwan, is currently a Packaging Engineer at Compal Electronics, Inc.. Peter Pi brings experience from previous roles at YFYJupiter. Peter Pi holds a 2009 - 2010 Master in Design Innovation @ De Montfort University. With a robust skill set that includes Corrugated, Packaging, Product Development, 3D rendering, Product Design and more. Peter Pi has 1 emails on RocketReach.
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