Paul Smith Email & Phone Number
Packaging Engineer @ Ventek Solutions
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Paul Smith Location
- Detroit, MI, US
Paul Smith Work
- Packaging Engineer @ (April 2024 - Present)
- Packaging Engineer @ (January 2018 - April 2024)
- Packaging Engineer Co-op @ (January 2017 - June 2017)
- Merchandising Solutions Co-op @ (June 2016 - December 2016)
Paul Smith Education
- Michigan State University
Packaging
2013-2017 - Waterford Mott High School 2009-2013
Paul Smith Skills
- Microsoft Office
- Packaging
- Bluecuda
- Project Management
- Microsoft Excel
- SAP
- 3D Modeling
- Packaging Engineering
- Time Management
- Merchandising
- Retail Displays
- PTC Creo
- ArtiosCAD
- Sales
- Protective Packaging
Paul Smith Summary
- Paul Smith, based in Detroit, MI, US, is currently a Packaging Engineer at Ventek Solutions. Paul Smith brings experience from previous roles at Sonoco, NOVA Chemicals and Pfizer. Paul Smith holds a 2013 - 2017 Packaging @ Michigan State University. With a robust skill set that includes Microsoft Office, Packaging, Bluecuda, Project Management, Microsoft Excel and more. Paul Smith has 2 emails and 1 mobile phone numbers on RocketReach.
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