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Paul Berndt Location
Kirkland, WA, US
Paul Berndt Work
Test Engineering Consultant @ NW Test Engineering LLC (January 2016 - Present)
Principal Test Engineer @ (June 2018 - July 2024)
Test Engineering Fellow @ (January 2010 - January 2016)
Member of the Technical Staff and Test Engineer @ (January 2002 - January 2010)
Principal Test Engineer @ (January 1998 - January 2002)
Senior Staff Test Engineer @ (January 1996 - January 1998)
Principal Test Engineer @ (January 1993 - January 1996)
Manufacturing Development Engineer @ Hewlett-Packard Corporation (January 1990 - January 1993)
Staff Product Engineer @ National Semiconductor (Formerly Fairchild Semiconductor) (January 1984 - January 1990)
Paul Berndt Education
University of Washington
MSEE
1989
Northwestern University
BSEE
1984
Paul Berndt Skills
Analog
Application-Specific Integrated Circuits (ASIC)
C
CMOS
Circuit Design
DFT
Debugging
Electronics
Embedded Systems
Engineering
Failure Analysis
Hardware
IC
Integrated Circuits (IC)
Labview
Manufacturing
Microcontrollers
Mixed Signal
PCB Design
Printed Circuit Board (PCB) Design
Product Development
Semiconductor Industry
Semiconductors
System on a Chip (SoC)
Test Engineering
Testing
USB
Yield
Paul Berndt Summary
Paul Berndt, based in Kirkland, WA, US, is currently a Test Engineering Consultant at NW Test Engineering LLC. Paul Berndt brings experience from previous roles at Microsoft and Cypress Semiconductor Corporation. Paul Berndt holds a MSEE @ University of Washington. With a robust skill set that includes Analog, Application-Specific Integrated Circuits (ASIC), C, CMOS, Circuit Design and more. Paul Berndt has 1 emails and 1 mobile phone numbers on RocketReach.
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