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Paul An Location
United States
Paul An Work
Technical Director, Etch and Deposition Systems @ (February 2022 - Present)
Director of Packaging Technology @ (August 2018 - October 2021)
Senior Engineering Manager, Packaging and Integration @ (July 2015 - August 2018)
Senior Process Engineer @ (December 2008 - June 2012)
Process Engineer, 45nm Technology @ (December 2005 - December 2008)
Intern, Device Modeling @ (July 2005 - December 2005)
Paul An Education
UC San Diego
Master's degree
Paul An Summary
Paul An, based in United States, is currently a Technical Director, Etch and Deposition Systems at Semiconductor Equipment Corp. Paul An brings experience from previous roles at Broadcom and Intel Corporation. Paul An holds a Master's degree @ UC San Diego.
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