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Patrick Upton Location
New York, NY, US
Patrick Upton Work
2025 -now Quantum Packaging Engineer @
2024 -2025 Dry Etch Process Engineer @
2022 -2024 Research Assistant - APT Center @
2023 -2023 Photolithography Process Engineering Intern @
2021 -2022 Research Assistant @ Electro-ceramics Group
2022 -2022 Research Intern - Group 81: Advanced Materials and Microsystems @
2020 -2021 Research Assistant @
Patrick Upton Education
Case Western Reserve University
(Electrical Engineering)
2020-2024
North Allegheny High School 2016-2020
Patrick Upton Summary
Patrick Upton, based in New York, NY, US, is currently a Quantum Packaging Engineer at IBM. Patrick Upton brings experience from previous roles at Intel Corporation, Louis Stokes Cleveland Vamc and Electro-ceramics Group. Patrick Upton holds a 2020 - 2024 Case Western Reserve University. Patrick Upton has 2 emails on RocketReach.
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