Pat Stover Email & Phone Number
Vice President of Technology Development, Advanced Packaging @ Intel Corporation
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Pat Stover Location
- Chandler, AZ, US
Pat Stover Work
- 2024 -now Vice President of Technology Development, Advanced Packaging @
- 2023 -2024 Vice President of Technology Development, Advanced Packaging @
- 2016 -2023 Senior Director, Advanced Packaging Technology Development @
- 2012 -2016 Director, Packaging and Assembly and Test Technology Development @
- 2006 -2012 Engineering Manager, Packaging and Assembly and Test Technology Development @
- 2001 -2006 Sr. Process Engineer @
- 1996 -2001 Process Engineer @
Pat Stover Education
- University of Illinois Urbana-Champaign
BS (Chemical Engineering)
1992-1996
Pat Stover Summary
- Pat Stover, based in Chandler, AZ, US, is currently a Vice President of Technology Development, Advanced Packaging at Intel Corporation. Pat Stover brings experience from previous roles at Intel Corporation. Pat Stover holds a 1992 - 1996 BS in Chemical Engineering @ University of Illinois Urbana-Champaign. Pat Stover has 6 emails and 6 mobile phone numbers on RocketReach.
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