Pat Stover Email & Phone Number
Vice President of Technology Development, Advanced Packaging @ Intel Corporation
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Pat Stover Location
- Chandler, AZ, US
Pat Stover Work
- Vice President of Technology Development, Advanced Packaging @ (March 2024 - Present)
- Vice President of Technology Development, Advanced Packaging @ (October 2023 - March 2024)
- Senior Director, Advanced Packaging Technology Development @ (April 2016 - October 2023)
- Director, Packaging and Assembly and Test Technology Development @ (April 2012 - March 2016)
- Engineering Manager, Packaging and Assembly and Test Technology Development @ (January 2006 - April 2012)
- Sr. Process Engineer @ (January 2001 - January 2006)
- Process Engineer @ (June 1996 - January 2001)
Pat Stover Education
- University of Illinois Urbana-Champaign
BS (Chemical Engineering)
1992-1996
Pat Stover Summary
- Pat Stover, based in Chandler, AZ, US, is currently a Vice President of Technology Development, Advanced Packaging at Intel Corporation. Pat Stover brings experience from previous roles at Intel Corporation. Pat Stover holds a 1992 - 1996 BS in Chemical Engineering @ University of Illinois Urbana-Champaign. Pat Stover has 6 emails and 6 mobile phone numbers on RocketReach.
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