Pak Chan Email

Product Development Engineer (Yield, Debug and Binsplit) @ Intel Corporation

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Pak Chan Location

Penang, Malaysia

Pak Chan Work

2021 - now Product Development Engineer (Yield, Debug and Binsplit) @ Intel Corporation
2020 - 2021 Graduate Trainee @ Intel Corporation
2020 - 2020 System Programmer @ Swinburne University of Technology Sarawak Campus
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2018 - 2018 Trainee @ Top Glove Sdn Bhd

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Pak Chan Education

Universiti Sains Malaysia
Master of Science - MS (Data Science and Analytics)
2022 - 2024
Swinburne University of Technology
Bachelor's degree (Mechatronics, Robotics, and Automation Engineering)
2015 - 2019

Pak Chan Summary

Pak Chan, based in Penang, Malaysia, is currently a Product Development Engineer (Yield, Debug and Binsplit) at Intel Corporation. Pak Chan brings experience from previous roles at Intel Corporation, Swinburne University of Technology Sarawak Campus and Top Glove. Pak Chan holds a 2022 - 2024 Master of Science - MS in Data Science and Analytics @ Universiti Sains Malaysia. Pak Chan has 3 emails on RocketReach.

Pak Chan Emails

Found 3 emails

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