Advanced equipment manufacturer, wafer level packaging (WLP) subcontracting service provider and chemistry supplier specialized in electroless under bump metallization (UBM), solder balling and back-end services with more than 25 years of experience after spinning off from the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany. Mother company: Nagase & Co., Ltd. with headquarters in Tokyo, Japan Facilities: Nauen, Germany (headquarters), Santa Clara, CA, USA & Penang, Malaysia
| Website | http://www.pactech.de |
| Employees | 99 (56 on RocketReach) |
| Address | Am Schlangenhorst, Nauen, Brandenburg 14641, DE |
| Industry | Semiconductor Manufacturing |
| Keywords | Semiconductor Packaging, Wafer Level Packaging, Advanced Packaging, Microelectronics Packaging, Chip Packaging, Metallization, Packaging Materials, Backend Services, Subcontracting, Equipment Manufacturing, Electronics Manufacturing, Assembly, Chemicals, Testing |
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PacTech - Packaging Technologies Questions
Neil MacRaild is the President- PacTech USA Inc of PacTech - Packaging Technologies.
56 people are employed at PacTech - Packaging Technologies.
PacTech - Packaging Technologies is based in Nauen, Brandenburg.
Top PacTech - Packaging Technologies Employees
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Neil MacRaild
President- PacTech USA Inc at PacTech - Packaging Technologies
California, United States24 -
Sebastian Laser
Produktionsleiter at PacTech - Packaging Technologies
Falkensee, BB, DE2 -
Nurlin Nadia
Production Planner at PacTech - Packaging Technologies
Bukit Mertajam, MY2
