Pac Tech International Competitors

At Nordson, we believe that anything is possible. We empower our global team of employees to engineer, manufacture, and market innovative products and systems that are essential to everyday life. These differentiated products and systems are used for precision dispensing and processing and serve a variety of end markets, including packaging, transportation, medical, and electronics. Founded in 1954, we are guided by our values of integrity, respect for people, customer passion, energy, and excellence. We care for our employees and provide them with opportunities to advance their careers and make an impact, inside and outside of work. Nordson is headquartered in Westlake, Ohio, and has direct operations in more than 35 countries to support our products and systems with application expertise and a direct global sales and service organization.

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.

Besi Netherlands B.V. is a product division of BE Semiconductor Industries N.V., which is publicly listed as BESI on EURONEXT (Amsterdam, the Netherlands). Besi Netherlands B.V. develops and manufactures machines for the semiconductor industry under the brand name Fico. This includes molding systems, trim & form equipment, laser markers, and singulation systems for leadframe and array connect substrates. Besi Netherlands B.V. outsources part of its production to sister companies in Malaysia and China. The customers of Besi Netherlands B.V. are leading global manufacturers of chips and their suppliers.