Ning Ye Email & Phone Number
Senior Director, Package Technology Development and Integration @ Western Digital
Ning Ye's Location
California, United States
Ning Ye's Work
- Senior Director, Package Technology Development and Integration @ Western Digital
- Senior Manager, Packaging Engineering @ SanDisk®
Ning Ye's Education
- University of California, Berkeley
Doctor of Philosophy - PhD (Mechanical Engineering)
- University of Chinese Academy of Sciences
Master of Science - MS (Solid Mechanics)
- University of Science and Technology of China
Bachelor of Science - BS (Theoretical and Applied Mechanics)
Ning Ye's Skills
- Semiconductors
- Failure Analysis
- Thin Films
- Manufacturing
- IC
- Design of Experiments
- Semiconductor Industry
- SPC
- Simulations
- JMP
Ning Ye's Summary
Ning Ye, based in California, United States, is currently a Senior Director, Package Technology Development and Integration at Western Digital, bringing experience from previous roles at SanDisk, a Western Digital Brand. Ning Ye holds a Doctor of Philosophy - PhD in Mechanical Engineering @ University of California, Berkeley. With a robust skill set that includes Semiconductors, Failure Analysis, Thin Films, Manufacturing, IC and more, Ning Ye contributes valuable insights to the industry. Ning Ye has 3 emails on RocketReach.
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