Nick Layman's Location
Cincinnati, OH, US
Nick Layman's Work
- Principal Package Development Engineer @ Ethicon, Inc.
- Staff Franchise Package Development Engineer @ Ethicon, Inc.
- Sr. Packaging Engineer @ Ethicon, Inc.
- Sales Engineer @ MSI Packaging Inc
- Sales Engineer @ ORBIS Corporation
- Packaging Engineer @ Sealed Air Corporation
- Package Engineer Intern @ Allergan
Nick Layman's Education
- Michigan State University
B.S. (Packaging)
1998 - 2002
Nick Layman's Skills
- Six Sigma
- Packaging
- Design Control
- Root Cause Analysis
- Process Validation
- Plastics
- Process Excellence
- FMEA
- CAD
- Validation
Nick Layman's Summary
Nick Layman, based in Cincinnati, OH, US, is currently a Principal Package Development Engineer at Ethicon, Inc., bringing experience from previous roles at Ethicon, Ethicon Endo-Surgery, MSI Packaging and ORBIS Corporation. Nick Layman holds a 1998 - 2002 B.S. in Packaging @ Michigan State University. With a robust skill set that includes Six Sigma, Packaging, Design Control, Root Cause Analysis, Process Validation and more, Nick Layman contributes valuable insights to the industry. Nick Layman has 2 emails on RocketReach.
5 free lookups per month.
Not the Nick Layman you were looking for?
Find contact details for 700 million professionals.
Others Named Nick Layman
-
42
-
31
-
11
Top Ethicon, Inc. Employees
-
45+
-
5+2
-
5+5+
-
44
-
43
-
55+
-
32
-
44
-
View
Molly Foley
Global Marketing Director Biosurgery at Ethicon, Inc.
West Windsor Township, NJ, US43 -
53
-
5+1
-
35+
-
ViewKen Bundy
Area Vice President, Strategic Customer Group at Johnson and Johnson at Ethicon, Inc.
Trabuco Canyon, CA, US32 -
41
How It Works
Get a Free Account
Sign up for a free account. No credit card required. Up to 5
free lookups / month.
Search
Search over 700
million verified professionals across 35 million companies.
Get Contact Info
Get contact details including emails and phone numbers
(business & personal).
G2Crowd Trusted
300K+
Plugin Users
