Engineering Program Manager @ (February 2019 - November 2020)
Principal Project Engineer @ (October 2015 - February 2019)
Senior Packaging Engineer @ (October 2014 - October 2015)
Manufacturing Group Leader @ (August 2013 - October 2014)
Manufacturing Engineer @ (May 2012 - October 2014)
Senior I Packaging Engineer @ (September 2009 - May 2012)
Packaging Engineer @ (September 2007 - September 2009)
Packaging Engineer @ (May 2006 - September 2007)
Packaging Engineer Intern @ (January 2005 - January 2005)
Nick Heslip Education
Ball State University - College of Business
Masters (Business Administration)
2009-2011
State
Bachelors
2002-2006
Nick Heslip Summary
Nick Heslip, based in Grand Rapids, MI, US, is currently a Senior Engineering Program Manager at Medtronic. Nick Heslip brings experience from previous roles at Medtronic. Nick Heslip holds a 2009 - 2011 Masters in Business Administration @ Ball State University - College of Business. Nick Heslip has 1 emails and 1 mobile phone numbers on RocketReach.
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