Neil C. Email
Lead Firmware Engineer @ UMDLoop
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Neil C. Location
- College Park, MD, US
Neil C. Work
- Lead Firmware Engineer @ (August 2026 - Present)
- System Engineer @ (October 2025 - August 2026)
- Systems Integration Intern @ (June 2026 - Present)
- Electrical Engineering Intern @ (June 2025 - June 2026)
- Fuel Cell Research Intern @ (June 2024 - August 2024)
Neil C. Education
- University of Maryland
B.S in Electrical Engineering
2025-2029
Neil C. Skills
- CAN bus
- Design Failure Mode and Effect Analysis (DFMEA)
- ESP32 Microcontrollers
- Git
- Manufacturing Process Improvement
- Multimeter
- Oscilloscope
- Piping and Instrumentation Drawing (P&ID)
- Printed Circuit Board (PCB) Design
- Project Management
- Proportional-Integral-Derivative (PID)
- Reverse Engineering
- STM32
- Standard Operating Procedure (SOP)
- Statistical Process Control (SPC)
- Verification and Validation (V&V)
- ZephyrRTOS
Neil C. Summary
- Neil C., based in College Park, MD, US, is currently a Lead Firmware Engineer at UMDLoop. Neil C. brings experience from previous roles at UMDLoop, Alchemity and University of Maryland. Neil C. holds a 2025 - 2029 B.S in Electrical Engineering @ University of Maryland. With a robust skill set that includes CAN bus, Design Failure Mode and Effect Analysis (DFMEA), ESP32 Microcontrollers, Git, Manufacturing Process Improvement and more. Neil C. has 1 emails on RocketReach.
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